Global spending on 300 mm chip manufacturing equipment to reach $374 billion over the next three years

According to SEMI’s 300mm Fab Outlook report, global spending on 300 mm chip manufacturing equipment is expected to reach $374 billion between 2026 and 2028. This significant investment reflects the regionalization of fabs and the growing demand for AI chips for data centers and edge devices, highlighting the push for semiconductor self-sufficiency in key regions through localized industrial ecosystems and supply chain restructuring.

Annual spending forecast

• 2025: $107 billion (+7%)

• 2026: $116 billion (+9%)

• 2027: $120 billion (+4%)

• 2028: $138 billion (+15%)

Key segments

• Logic & micro: $175 billion (2026–2028), driven by foundries and capacity expansion below 2 nm.

• Memory: $136 billion, with major investments in DRAM ($79 billion) and 3D NAND ($56 billion).

• Analog & power: over $41 billion, including wide-bandgap semiconductors and power devices.

Regional focus

• China: $94 billion

• South Korea: $86 billion

• Taiwan: $75 billion

• United States: $60 billion

SEMI emphasizes that expanding 300 mm fabs is critical for the advancement of data centers, edge devices, and the digital economy. The rising demand for AI chips is driving this transformation, with advanced technologies such as gate-all-around (GAA) architectures and backside power delivery playing a key role in improving chip performance and energy efficiency.

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