Custom ASIC design from specs to silicon
Turnkey chip development when you need reliability and don’t want to handle the whole process of design. You get tested, production-ready chips while we handle the entire process.
Focused expertise with reliable results.
Our team has spent years designing PMICs, sensor front-ends with signal processing, and high-frequency systems on FinFET technology.
Power Management
Our team specialized in developing the most efficient solution to manage all what concern power supply and distribution in your chip or system.
Signal Processing
Expert engineers in developing top tier analog front-end solution for sensor and MEMS read out circuit as well as advanced signal processing chains.
FinFET
Engineers specialized in working on extremely scaled technology to achieve the next step of IC development on high performance silicon devices.
Custom ASIC Design Process
From architecture definition through production silicon. Here's how the project unfolds.
Discovery & Feasibility
Your requirements get stress-tested: technical risks, area constraints, timeline, cost. We find the best trade-off before any silicon commitment and define the most efficient architecture for your custom chip.
Cell-Level Design
Individual circuit blocks are designed and validated across all operating scenarios, then laid out with particular attention to critical paths. Post-layout simulation confirms everything works with real parasitic effects included.
Top-Level Integration
Validated cells come together into the full chip. We apply the same rigor at system scale (sizing, verification, layout, PLS) while managing power distribution, signal integrity, and chip-wide routing. Top-level analog and mixed-signal simulations verify that digital and analog sections work together correctly. We also implement and test DFT structures at this stage, essential for bench testing the final chip. Final validation happens before tapeout.
Tapeout & Manufacturing
Layout gets locked and sent to the foundry: transistor layers, interconnections, everything. Manufacturing begins and you'll have silicon in hand within months.
Testing & Validation
Chips come back and get validated. We compare measured results against simulation data to identify any discrepancies and build a bug list for resolution. Qualification support for automotive or industrial if needed.
Our designs
How we reduce your risk
Chip Type Expertise
We stick to what we know: power management, mixed-signal, high-frequency FinFET. Deep experience in domains where precision matters.
In-house AI verification
Spaceman, our proprietary tool, cuts design time while automatically tuning circuit properties like circuit performance, power consumption, and area.
Full IP ownership
Your design stays yours. No reuse, no shared IP blocks and no exceptions.
Post-layout validation
Simulations run with real parasitic effects, not theoretical models. We do this twice before tapeout: once at cell level, once at top level.
Multi-corner analysis
Every design validated across operating extremes: temperature, voltage, process variations. This way there are no surprises when you hit production.
Package parasitics integration
We simulate with realistic package and PCB parasitic models, capturing the resistance, inductance, and capacitance from bonding wires, lead frames, and board-level interconnects. No surprises when silicon meets the system.
Ready to start?
A clear process from first call to working silicon. Here's how we typically engage.
Discovery call
30 minutes to understand your project and constraints
Feasibility assessment
We evaluate project requirements, technical risks and trade-offs
Detailed project proposal
Your receive the timeline, estimated cost and scope